UWIN is eager to support your needs in semiconductor consumables and production equipment.

TEL. +81-3-6450-1690

3-9-3 Nishi Shinbashi , Minato-ku, Tokyo 105-0003

Sample request for dicing tape.

3-9-3 Nishi Shinbashi , Minato-ku, Tokyo, Japan 105-0003

TEL +81-3-6450-1690

About the tapes you are currently using
Tape type	UV Non-UV Antistatic
Varieties of tape
Tape size	mm x m
Total thickness of tape
Adhesive strength
Monthly usage
Work piece / application information
wafer	Si GaAs GaN Glass Ceramic Other
If Other, specify
Substrate	BGA LGA CMOS CCD WLCSP Other
If Other, specify
Work piece thickness	mm
Wafer size	mm / inch
Substrate size	OR mm x mm
Chip size	mm x mm
Surface bumps	mm / Bumpなど
Amount of cut into the tape
Dicer model
Dicing blade thickness
Contact Information
Name
Title
Company
Address
Email
Phone
Comments
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