Uwin is eager to support your needs in semiconductor consumables and production equipment.

List of service and product

Dicing Tape and Back Grinding Tape

High function tapes used for production in semiconductor and electrical component. UV type, None UV type is available depending on the process.
- Tapes for wafer dicing.
- Tapes for package dicing.
- BG tape
- Denka Eleglip Tape

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Antistatic device for pure water

It is an equipment to control the resistivity value of ultra-pure water by a method in which carbon dioxide gas is fed through Hollw fiver gas permeation membranes.
- A range of models with treated water capacities to meet your needs, from 16L/min to 116L/min.
- Built-in inverter pump allows adjustment of treated water pressure (specialised models).
- DIC eFlow series

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Semiconductor related equipment and parts

- Tape mounters (dicing tape)
- Tape laminators and tape peeling machines (BG tape)
- UV irradiation machines (high-pressure mercury lamps, LED lamps, black lamps)
- Spin washers
- Chip sorters
- Modifications to existing equipment and maintenance parts.

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Dicing Blade

- Dicing Blade - Metal bond / Regin bond / Electroformed Bond
- Hub Blades
- Polyimide resin bond blade - CEPLAX
The bond is made of polyimide, a super heat-resistant resin. This bond has excellent wear resistance and shape retention due to its low thermal degradation and very high rigidity.
Applications: CSP substrates / Glass, etc. / CMOS substrates / Ceramics / Tungsten carbide, etc.
- Newly developed metal bond blade - G-bond blade
The unique sintering technology has achieved a sharpness that conventional metal bonds could not have and a longer service life compared to resin bonds.Suitable for precision cutting and grooving of brittle materials, carbide, steel and metallic materials with low chipping and high quality.

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Grinding Wheel

- Si wafer grinding wheels
- SiC wafer grinding wheels: low-damage grinding / ultra-thin finish grinding
A vitrified bond is used to achieve grinding quality aimed at reducing the burden on the CMP process. The line-up from #2000 to #30000 enables proposals to be made according to the purpose, such as low damage and ultra-thin finish grinding.

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POLYMOND - Polishing and cleaning sheet

Polishing and cleaning sheet made of a mixture of abrasive diamond grains and polyimide resin, which is resistant to heat, chemicals and deformation, and moulded in one piece.
Suitable for polishing hard and brittle materials such as glass, ceramics and cemented carbide.

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Grinding, Dicing and Reclaimed Wafer Processing service

- Grinding
- Polishing (dry polishing/CMP)
- Cutting (dicing)
- Pick-up - Tray filling - Inspection
- Available for various materials such as silicon wafers, SiC wafers and glass.

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Dummy package/ Silicon wafer

We can provide small lot of dummy wafers and QFN used for evaluation purposes.
SiC 4H N-type - 6 inch, 8 inch (Dummy / Production)
SiC 4H N-type Epi 650V - 6 inch, 8 inch (Dummy / Production)
Pls. contact us for any other supports you may require.